Fr4 for example has a higher dissipation factor than high frequency laminates meaning fr4 laminates can result in higher insertion losses as signal frequencies increase.
Rf pcb laminate.
Rf microwave pcb laminate material.
Rf and microwave pcb with high frequency laminates can be difficult to design because of the sensitivity of the signals especially compared to other digital signals.
The selection of microwave rf pcb laminate should consider its dielectric properties first but must also consider the types and thickness of surface copper foil environmental adaptability processability factors as well as cost problem.
Currently the most commonly used of the copper foil thickness is 35 μm and 18μm.
Here are a few things to consider that ensure your design is efficient and minimizes the risk of failures signal disruptions and other intrusions.
1 the types and thickness of copper foil.
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Laminate materials with low dielectric properties technical paper this paper focuses on new laminate materials with potential uses in multilayer printed circuit boards pcbs for high speed digital rf microwave applications.
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